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ASSMANN WSW 2.54mm Pitch Vertical 8 Way, Through Hole Stamped Pin Open Frame IC Dip Socket, 1A

ASSMANN WSW 2.54mm Pitch Vertical 8 Way, Through Hole Stamped Pin Open Frame IC Dip Socket, 1A, Row Width: 7.62mm, Termination Method: Solder, Contact Plating: Tin, Length: 10.16mm, Depth: 5.1mm, Dimensions: 10.16 x 10.16 x 5.1mm, Contact Material: Phosphor Bronze, MPN: A 08-LC-TT

GBP 0.15

1

ASSMANN WSW 2.54mm Pitch Vertical 6 Way, Through Hole Stamped Pin Open Frame IC Dip Socket, 1A

ASSMANN WSW 2.54mm Pitch Vertical 6 Way, Through Hole Stamped Pin Open Frame IC Dip Socket, 1A, Row Width: 7.62mm, Termination Method: Solder, Contact Plating: Tin, Width: 5.16mm, Depth: 10mm, Dimensions: 7.62 x 5.16 x 10mm, Contact Material: Phosphor Bronze, MPN: A 06-LC-TT

GBP 0.23

1

ASSMANN WSW 2.54mm Pitch Vertical 8 Way, Through Hole Stamped Pin Open Frame IC Dip Socket, 1A

ASSMANN WSW 2.54mm Pitch Vertical 8 Way, Through Hole Stamped Pin Open Frame IC Dip Socket, 1A, Row Width: 7.62mm, Termination Method: Solder, Contact Plating: Tin, Length: 10.16mm, Depth: 5.1mm, Dimensions: 10.16 x 10.16 x 5.1mm, Contact Material: Phosphor Bronze, MPN: A 08-LC-TT

GBP 0.12

1

ASSMANN WSW 2.54mm Pitch Vertical 6 Way, Through Hole Stamped Pin Open Frame IC Dip Socket, 1A

ASSMANN WSW 2.54mm Pitch Vertical 6 Way, Through Hole Stamped Pin Open Frame IC Dip Socket, 1A, Row Width: 7.62mm, Termination Method: Solder, Contact Plating: Tin, Width: 5.16mm, Depth: 10mm, Dimensions: 7.62 x 5.16 x 10mm, Contact Material: Phosphor Bronze, MPN: A 06-LC-TT

GBP 0.17

1

ASSMANN WSW 2.54mm Pitch Vertical 24 Way, Through Hole Stamped Pin Open Frame IC Dip Socket, 1A

ASSMANN WSW 2.54mm Pitch Vertical 24 Way, Through Hole Stamped Pin Open Frame IC Dip Socket, 1A, Row Width: 15.24mm, Termination Method: Solder, Contact Plating: Tin, Length: 30.48mm, Width: 17.78mm, Depth: 5.1mm, Dimensions: 30.48 x 17.78 x 5.1mm, Contact Material: Phosphor Bronze, MPN: A 24-LC-TT

GBP 0.19

1

ASSMANN WSW 2.54mm Pitch Vertical 32 Way, Through Hole Stamped Pin Open Frame IC Dip Socket, 1A

ASSMANN WSW 2.54mm Pitch Vertical 32 Way, Through Hole Stamped Pin Open Frame IC Dip Socket, 1A, Row Width: 15.24mm, Termination Method: Solder, Contact Plating: Tin, Length: 40.64mm, Width: 17.78mm, Depth: 5.1mm, Dimensions: 40.64 x 17.78 x 5.1mm, Contact Material: Phosphor Bronze, MPN: A 32-LC-TT

GBP 0.32

1

ASSMANN WSW 2.54mm Pitch Vertical 14 Way, Through Hole Stamped Pin Open Frame IC Dip Socket, 1A

ASSMANN WSW 2.54mm Pitch Vertical 14 Way, Through Hole Stamped Pin Open Frame IC Dip Socket, 1A, Row Width: 7.62mm, Termination Method: Solder, Contact Plating: Tin, Length: 17.78mm, Width: 10.16mm, Depth: 5.1mm, Dimensions: 17.78 x 10.16 x 5.1mm, Contact Material: Phosphor Bronze, MPN: A 14-LC-TT

GBP 0.18

1

ASSMANN WSW 2.54mm Pitch Vertical 16 Way, Through Hole Stamped Pin Open Frame IC Dip Socket, 1A

ASSMANN WSW 2.54mm Pitch Vertical 16 Way, Through Hole Stamped Pin Open Frame IC Dip Socket, 1A, Row Width: 7.62mm, Termination Method: Solder, Contact Plating: Tin, Length: 20.32mm, Width: 10.16mm, Depth: 5.1mm, Dimensions: 20.32 x 10.16 x 5.1mm, Contact Material: Phosphor Bronze, MPN: A 16-LC-TT

GBP 0.20

1

ASSMANN WSW 2.54mm Pitch Vertical 24 Way, Through Hole Stamped Pin Open Frame IC Dip Socket, 1A

ASSMANN WSW 2.54mm Pitch Vertical 24 Way, Through Hole Stamped Pin Open Frame IC Dip Socket, 1A, Row Width: 15.24mm, Termination Method: Solder, Contact Plating: Tin, Length: 30.48mm, Width: 17.78mm, Depth: 5.1mm, Dimensions: 30.48 x 17.78 x 5.1mm, Contact Material: Phosphor Bronze, MPN: A 24-LC-TT

GBP 0.29

1

ASSMANN WSW 2.54mm Pitch Vertical 20 Way, Through Hole Stamped Pin Open Frame IC Dip Socket, 1A

ASSMANN WSW 2.54mm Pitch Vertical 20 Way, Through Hole Stamped Pin Open Frame IC Dip Socket, 1A, Row Width: 7.62mm, Termination Method: Solder, Contact Plating: Tin, Length: 25.4mm, Width: 10.16mm, Depth: 5.1mm, Dimensions: 25.4 x 10.16 x 5.1mm, Contact Material: Phosphor Bronze, MPN: A 20-LC-TT

GBP 0.20

1

ASSMANN WSW 2.54mm Pitch Vertical 16 Way, Through Hole Stamped Pin Open Frame IC Dip Socket, 1A

ASSMANN WSW 2.54mm Pitch Vertical 16 Way, Through Hole Stamped Pin Open Frame IC Dip Socket, 1A, Row Width: 7.62mm, Termination Method: Solder, Contact Plating: Tin, Length: 20.32mm, Width: 10.16mm, Depth: 5.1mm, Dimensions: 20.32 x 10.16 x 5.1mm, Contact Material: Phosphor Bronze, MPN: A 16-LC-TT

GBP 0.15

1

ASSMANN WSW 2.54mm Pitch Vertical 32 Way, Through Hole Stamped Pin Open Frame IC Dip Socket, 1A

ASSMANN WSW 2.54mm Pitch Vertical 32 Way, Through Hole Stamped Pin Open Frame IC Dip Socket, 1A, Row Width: 15.24mm, Termination Method: Solder, Contact Plating: Tin, Length: 40.64mm, Width: 17.78mm, Depth: 5.1mm, Dimensions: 40.64 x 17.78 x 5.1mm, Contact Material: Phosphor Bronze, MPN: A 32-LC-TT

GBP 0.39

1

ASSMANN WSW 2.54mm Pitch Vertical 40 Way, Through Hole Stamped Pin Open Frame IC Dip Socket, 1A

ASSMANN WSW 2.54mm Pitch Vertical 40 Way, Through Hole Stamped Pin Open Frame IC Dip Socket, 1A, Row Width: 15.24mm, Termination Method: Solder, Contact Plating: Tin, Length: 50.8mm, Width: 17.78mm, Depth: 5.1mm, Dimensions: 50.8 x 17.78 x 5.1mm, Contact Material: Phosphor Bronze, MPN: A 40-LC-TT

GBP 0.42

1

ASSMANN WSW 2.54mm Pitch Vertical 18 Way, Through Hole Stamped Pin Open Frame IC Dip Socket, 1A

ASSMANN WSW 2.54mm Pitch Vertical 18 Way, Through Hole Stamped Pin Open Frame IC Dip Socket, 1A, Row Width: 7.62mm, Termination Method: Solder, Contact Plating: Tin, Length: 22.76mm, Width: 5.16mm, Depth: 9.96mm, Dimensions: 22.76 x 5.16 x 9.96mm, Contact Material: Phosphor Bronze, MPN: A 18-LC-TT

GBP 0.23

1

ASSMANN WSW 2.54mm Pitch Vertical 28 Way, Through Hole Stamped Pin Open Frame IC Dip Socket, 1A

ASSMANN WSW 2.54mm Pitch Vertical 28 Way, Through Hole Stamped Pin Open Frame IC Dip Socket, 1A, Row Width: 15.24mm, Termination Method: Solder, Contact Plating: Tin, Length: 35.56mm, Width: 17.78mm, Depth: 5.1mm, Dimensions: 35.56 x 17.78 x 5.1mm, Contact Material: Phosphor Bronze, MPN: A 28-LC-TT

GBP 0.29

1

ASSMANN WSW 2.54mm Pitch Vertical 18 Way, Through Hole Stamped Pin Open Frame IC Dip Socket, 1A

ASSMANN WSW 2.54mm Pitch Vertical 18 Way, Through Hole Stamped Pin Open Frame IC Dip Socket, 1A, Row Width: 7.62mm, Termination Method: Solder, Contact Plating: Tin, Length: 22.76mm, Width: 5.16mm, Depth: 9.96mm, Dimensions: 22.76 x 5.16 x 9.96mm, Contact Material: Phosphor Bronze, MPN: A 18-LC-TT

GBP 0.19

1

ASSMANN WSW 2.54mm Pitch Vertical 20 Way, Through Hole Stamped Pin Open Frame IC Dip Socket, 1A

ASSMANN WSW 2.54mm Pitch Vertical 20 Way, Through Hole Stamped Pin Open Frame IC Dip Socket, 1A, Row Width: 7.62mm, Termination Method: Solder, Contact Plating: Tin, Length: 25.4mm, Width: 10.16mm, Depth: 5.1mm, Dimensions: 25.4 x 10.16 x 5.1mm, Contact Material: Phosphor Bronze, MPN: A 20-LC-TT

GBP 0.24

1

ASSMANN WSW 2.54mm Pitch Vertical 28 Way, Through Hole Stamped Pin Open Frame IC Dip Socket, 1A

ASSMANN WSW 2.54mm Pitch Vertical 28 Way, Through Hole Stamped Pin Open Frame IC Dip Socket, 1A, Row Width: 7.62mm, Termination Method: Solder, Contact Plating: Tin, Length: 35.46mm, Width: 10.16mm, Dimensions: 35.46 x 10.16mm, Contact Material: Phosphor Bronze, Housing Material: PET, MPN: A 28-LC/7-T

GBP 0.32

1

ASSMANN WSW 2.54mm Pitch Vertical 14 Way, Through Hole Stamped Pin Open Frame IC Dip Socket, 1A

ASSMANN WSW 2.54mm Pitch Vertical 14 Way, Through Hole Stamped Pin Open Frame IC Dip Socket, 1A, Row Width: 7.62mm, Termination Method: Solder, Contact Plating: Tin, Length: 17.78mm, Width: 10.16mm, Depth: 5.1mm, Dimensions: 17.78 x 10.16 x 5.1mm, Contact Material: Phosphor Bronze, MPN: A 14-LC-TT

GBP 0.15

1

ASSMANN WSW 2.54mm Pitch Vertical 28 Way, Through Hole Stamped Pin Open Frame IC Dip Socket, 1A

ASSMANN WSW 2.54mm Pitch Vertical 28 Way, Through Hole Stamped Pin Open Frame IC Dip Socket, 1A, Row Width: 7.62mm, Termination Method: Solder, Contact Plating: Tin, Length: 35.46mm, Width: 10.16mm, Dimensions: 35.46 x 10.16mm, Contact Material: Phosphor Bronze, Housing Material: PET, MPN: A 28-LC/7-T

GBP 0.28

1

ASSMANN WSW 2.54mm Pitch Vertical 28 Way, Through Hole Stamped Pin Open Frame IC Dip Socket, 1A

ASSMANN WSW 2.54mm Pitch Vertical 28 Way, Through Hole Stamped Pin Open Frame IC Dip Socket, 1A, Row Width: 15.24mm, Termination Method: Solder, Contact Plating: Tin, Length: 35.56mm, Width: 17.78mm, Depth: 5.1mm, Dimensions: 35.56 x 17.78 x 5.1mm, Contact Material: Phosphor Bronze, MPN: A 28-LC-TT

GBP 0.35

1

ASSMANN WSW 2.54mm Pitch Vertical 40 Way, Through Hole Stamped Pin Open Frame IC Dip Socket, 1A

ASSMANN WSW 2.54mm Pitch Vertical 40 Way, Through Hole Stamped Pin Open Frame IC Dip Socket, 1A, Row Width: 15.24mm, Termination Method: Solder, Contact Plating: Tin, Length: 50.8mm, Width: 17.78mm, Depth: 5.1mm, Dimensions: 50.8 x 17.78 x 5.1mm, Contact Material: Phosphor Bronze, MPN: A 40-LC-TT

GBP 0.35

1

ASSMANN WSW 2.54mm Pitch Vertical 24 Way, Through Hole Stamped Pin Open Frame IC Dip Socket, 1A

ASSMANN WSW 2.54mm Pitch Vertical 24 Way, Through Hole Stamped Pin Open Frame IC Dip Socket, 1A, Row Width: 7.62mm, Termination Method: Solder, Contact Plating: Tin, Length: 30.38mm, Width: 5.16mm, Depth: 17.68mm, Dimensions: 30.38 x 5.16 x 17.68mm, Contact Material: Phosphor Bronze, MPN: A 24-LC/7-T

GBP 0.36

1

ASSMANN WSW 2.54mm Pitch Vertical 24 Way, Through Hole Stamped Pin Open Frame IC Dip Socket, 1A

ASSMANN WSW 2.54mm Pitch Vertical 24 Way, Through Hole Stamped Pin Open Frame IC Dip Socket, 1A, Row Width: 7.62mm, Termination Method: Solder, Contact Plating: Tin, Length: 30.38mm, Width: 5.16mm, Depth: 17.68mm, Dimensions: 30.38 x 5.16 x 17.68mm, Contact Material: Phosphor Bronze, MPN: A 24-LC/7-T

GBP 0.30

1

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ASSMANN WSW 2.54mm Pitch Vertical 8 Way, Through Hole Stamped Pin Open Frame IC Dip Socket, 1A

ASSMANN WSW 2.54mm Pitch Vertical 6 Way, Through Hole Stamped Pin Open Frame IC Dip Socket, 1A

ASSMANN WSW 2.54mm Pitch Vertical 8 Way, Through Hole Stamped Pin Open Frame IC Dip Socket, 1A

ASSMANN WSW 2.54mm Pitch Vertical 6 Way, Through Hole Stamped Pin Open Frame IC Dip Socket, 1A

ASSMANN WSW 2.54mm Pitch Vertical 24 Way, Through Hole Stamped Pin Open Frame IC Dip Socket, 1A

ASSMANN WSW 2.54mm Pitch Vertical 32 Way, Through Hole Stamped Pin Open Frame IC Dip Socket, 1A

ASSMANN WSW 2.54mm Pitch Vertical 14 Way, Through Hole Stamped Pin Open Frame IC Dip Socket, 1A

ASSMANN WSW 2.54mm Pitch Vertical 16 Way, Through Hole Stamped Pin Open Frame IC Dip Socket, 1A

ASSMANN WSW 2.54mm Pitch Vertical 24 Way, Through Hole Stamped Pin Open Frame IC Dip Socket, 1A

ASSMANN WSW 2.54mm Pitch Vertical 20 Way, Through Hole Stamped Pin Open Frame IC Dip Socket, 1A

ASSMANN WSW 2.54mm Pitch Vertical 16 Way, Through Hole Stamped Pin Open Frame IC Dip Socket, 1A

ASSMANN WSW 2.54mm Pitch Vertical 32 Way, Through Hole Stamped Pin Open Frame IC Dip Socket, 1A

ASSMANN WSW 2.54mm Pitch Vertical 40 Way, Through Hole Stamped Pin Open Frame IC Dip Socket, 1A

ASSMANN WSW 2.54mm Pitch Vertical 18 Way, Through Hole Stamped Pin Open Frame IC Dip Socket, 1A

ASSMANN WSW 2.54mm Pitch Vertical 28 Way, Through Hole Stamped Pin Open Frame IC Dip Socket, 1A

ASSMANN WSW 2.54mm Pitch Vertical 18 Way, Through Hole Stamped Pin Open Frame IC Dip Socket, 1A

ASSMANN WSW 2.54mm Pitch Vertical 20 Way, Through Hole Stamped Pin Open Frame IC Dip Socket, 1A

ASSMANN WSW 2.54mm Pitch Vertical 28 Way, Through Hole Stamped Pin Open Frame IC Dip Socket, 1A

ASSMANN WSW 2.54mm Pitch Vertical 14 Way, Through Hole Stamped Pin Open Frame IC Dip Socket, 1A

ASSMANN WSW 2.54mm Pitch Vertical 28 Way, Through Hole Stamped Pin Open Frame IC Dip Socket, 1A

ASSMANN WSW 2.54mm Pitch Vertical 28 Way, Through Hole Stamped Pin Open Frame IC Dip Socket, 1A

ASSMANN WSW 2.54mm Pitch Vertical 40 Way, Through Hole Stamped Pin Open Frame IC Dip Socket, 1A

ASSMANN WSW 2.54mm Pitch Vertical 24 Way, Through Hole Stamped Pin Open Frame IC Dip Socket, 1A

ASSMANN WSW 2.54mm Pitch Vertical 24 Way, Through Hole Stamped Pin Open Frame IC Dip Socket, 1A

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